Hybrid test bond removal procedure
As it was decided in the TEC meeting on Sep
21st, hybrid test bonds will be removed.
Temporarily, this work has to be done in Bonding Centers, Petal
Integration Centers and Gantry Centers. Once the pipeline is filled
with modules from the Gantry centers, the work will come to a natural stop in
BCs and PICs.
Until then, the removal of test bonds is mandatory for all modules not
mounted on petals.
You have two possibilities to remove hybrid test bonds:
- Using Kapton™ tape: See the detailed instructions on how
to remove hybrid test bonds with Kapton™ tape.
- Using tweezers: Read the comment from Alan Honma: "We
generally use tweezers to remove bond wires but you need high quality tweezers
to be able to grab 25 μ wire. The big disadvantage is its easy to drop the
wires or break them and move them to where you dont see them. I would advise
tweezers only for well trained personnel with good equipment (microscope and
tweezers) and steady hands."
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