Information about Backside Bonding

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We have designed a bonding jig that can support front-side bonded modules during back-side bonding.
	This picture shows a module in its transport frame that is mounted on the backplane bonding jig with its strip side facing down.
We are making 20 bonds, 10 bonds per side. This enables us to pull 2 bonds from each side, then still 16 bonds are left. The bond loop height is 600 μm over the silicon surface, to allow for movements between kapton and silicon.

Pull-tests were done on Brussels production modules with additional glue dots fixing the Kapton™ to the silicon. Pull forces were about 8.5 - 9.5 cN with standard deviation of about 0.5 - 1.5 cN.

For a test, we have encapsulated back-side bonds with Sylgard 186 silicone glue. We plan to test backside-bonded modules with and without encapsulated bonds on a shaking machine with a random frequency spectrum and average acceleration of 3.6 g.

Author: Martin.Weber@cern.ch Last modified: Wed Aug 18 14:51:11 2010